Product

NEMST-2002ILP 系列

In-line Plasma Cleaner (Vertical Type)

In-line Plasma Cleaner (Vertical Type)
In-line Plasma Cleaner (Vertical Type)
  • In-line Plasma Cleaning Process.
  • Advanced Flow Pattern Design.
  • High-Speed Plasma Cleaning: 30~40 seconds/cycle in general, including loading, plasma treatment and unloading.
  • Low Temperature Plasma Cleaning.+F6+F7:F9+F7
  • 1. By employing high frequency RF power supply and unique plasma electrodes design, high density plasma can be induced.
  • 2. Using Ar or O2 as the reaction gases for plasma.
  • 3. Cycle Time is about 30 seconds and 2 Jedec trays can be treated in one cycle simultaneously.
  • 4. Freindly operating interface for convenient, safe and stable production.. +F6+F7:F9+F7
  • Apply to Process before Die-bonding, Wire-bonding or Molding in IC Packaging or LED Packaging Applications.
  • Wafer Cleaning.
  • Suitable for Flip-Chip, PBGA, Window-BGA, Mini-BGA, Micro-BGA, QFN/MLP, TFBGA (Film-BGA), LFBGA, VBGA (EBGA), Pin BGA, QFN/MLP, TCP, PCB, COB, Cu L/F, Ag-Plating L/F, Fe L/F, MMC, SD, Micro-SD, etc. Suitable for Surface Treatment (Cleaning, Modification) for Electronics or Non-electronics Devices/Components.